职责描述： 1. Development of Qualification plans, DoE plans and procedures, Evaluation procedures etc… 2. Follow up in the system with Basic findings (BF's) and internal Deviations (ID's). Make sure, they are closed in time and all required corrective actions are done and evaluated 3. Maintain Yield baseline and improve Yield Performance, Yield monitoring and Low Yield Analyses 4.Management of Process relevant QMS Documents like Process instruction, Organized Reaction Plan, Checklists etc… 5.Parameter definition for Machines and Processes 6.Releasing of Machines with focus on process excursion RC and recovery, validate the completion of supplier modification/engineering fixing. Final overview the process healthiness.Releasing of Engineering Lots, DoE Lots and Special lots like skewed IWV Lots etc.. No Release of Standard Production lots 7.Coordinate work with other departments related to machine supplier or Material supplier 任职要求： 1.Degree from university or higher technical college 2.Process engineering experience in IC-Substrate, HDI-PCB, Assembly, IC-Packaging or related industry 3.Knowledge of quality tools like SPC, MSA, DOE, FMEA, CP, etc 4.Good analytical skills with attention to details. 5.Good stress management skills 6.Knowledge of project management, data evaluation and design of experiments 7.Fluent written and oral English (Mandarin would be of advantage) 8.Good team working spirit and leadership skills 9.Good communication and negotiation skills 10.Computer skills – MS Office Package (Word, Excel)