Job Description岗位说明： - develop, design and qualification of new products, technologies, equipment, material, processes and production lines 对新的产品，工艺，设备，物料，流程和生产线进行研发，设计和认证。 - define new product, process and equipment specifications 对新的产品，工艺流程以及设备规格进行定义。 - provide feasibility studies of new concepts and ideas 提供可行的新概念和构想进行研究。 - define and implement measurements to ensure product quality 定义和执行质量测量以确保产品的高质量。 - liaison with external suppliers (equipment, material or chemical suppliers) and internal relevant departments for technological development and process improvement 联络外部设备供应商（设备，物料或者药水供应商）和内部相关部门合作以优化工艺和流程。 - take responsibility in new process qualification and new product implementation 负责新制程的认证和新产品的导入。 - ensure stable and robust process with full procedure compliance to manufacture high quality and reliable products 确保整个流程的稳定，以便生产出高品质，高保障的产品。 - actively participate or drive project for new process qualification, new product implementation 积极参与或者推动认证新制程和导入新产品的项目。 - continuously improve the process capability, quality, yield, productivity and resource optimization 持续提高制程能力,质量，良率，生产能力和资源***化能力。 - train the new employees and transfer know-how to other engineers to relevant departments and other plant 培训新员工和传授专业技能给其他相关部门和工厂的工程师。 - document know-how and keep updating quality related details so as to handover the well-established processes for mass production 修订专业技能文件，并且持续更新与质量相关的细节，以便将这些建立好的工序交接给量产。 Requirement 岗位要求 - bachelor degree,major in engineering 本科学历，工科专业 - knowledge of quality tools like spc, msa, doe, fmea, cp, etc 掌握质量工具spc, msa, doe, fmea, cp等知识 - good analytical skills with attention to details. 良好的细节分析能力 - process engineering experience in ic-substrate, hdi-pcb, assembly, ic-packaging or related industry 具备ic- substrate, hdi-pcb, assembly, ic-packaging或者相关行业工艺制程经验 - fluent written and oral english (passed CET-4) 良好的英语听书读写能力